Heat-Conducting Ring

Heat-Conducting Ring is a high-performance material designed to improve the efficiency of heat dissipation in equipment. It is made of a high-purity, thermally conductive material with excellent heat transfer capabilities that quickly transfer heat from a heat source to a heat sink or other cooling device. This ring material is typically used to fill gaps in electronic devices to optimize heat dissipation paths and reduce hot spot generation. It is designed to provide a larger contact area, which improves the performance of the thermal interface. In addition, Heat-Conducting Ring has good electrical insulation properties and chemical stability, allowing it to maintain reliability in a variety of extreme environments. Suitable for heat dissipation applications for CPUs, GPUs, LEDs and other electronic components, it is a key accessory for enhancing the performance of electronic products.

Product Parameters

Products Features

• High-efficiency thermal conduction: excellent thermal conductivity, rapid heat transfer.

• Optimized heat dissipation design: Fill the gap of the equipment to increase the contact area of heat dissipation.

• Electrical insulation: Provide good electrical insulation to ensure equipment safety.

• Chemical Stability: Temperature and corrosion resistant, suitable for a wide range of environmental conditions.

• Wide range of applications: Compatible with a wide range of electronic devices, such as CPUs, GPUs and LEDs.